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Process and Technology of Electroplating Equipment for Electroplating Equipment
Edit:Dongguan City Xin Sen Electronics Co., Ltd   PublicDate:2017-10-26

Electroplating of the target , electroplating equipment, the electroplating process and technology:

Process requirements

1. Coating and the base metal, between the coating and the coating, should have a good binding force.

2. The coating should be fine crystal, smooth, uniform thickness.

3. The coating shall have a specified thickness and as little porosity as possible.

4. Coating should have the specified indicators, such as brightness, hardness, conductivity and so on.

5. The plating time and the temperature of the plating process determine the thickness of the coating.

6. Ambient temperature is -10 ℃ ~ 60 ℃.

7. The input voltage is 220V ± 22V or 380V ± 38V.

8. The maximum working noise of the water treatment equipment should be no more than 80dB (A).

9. The relative humidity (RH) should be no more than 95%.

10. Raw water COD content of 100mg / L ~ 150000mg / L.

Electroplating technology

Electroplating technology, also known as electrodeposition, is one of the main methods of obtaining metal coatings on the surface of materials. Is the process of depositing the metal ions in the solution onto the surface of the cathode plating in the electrolyte solution (bath) by the anode and the cathode under the action of the DC electric field; the current efficiency: the total amount of electricity used for depositing the metal The ratio of the amount of electricity is called the current efficiency of the plating.

Dispersion ability: the dispersion of the bath is a certain electrolysis conditions under the conditions of the deposition of metal in the cathode parts on the surface of the uniform capacity.

Alloy plating: Two or more metal ions on the cathode co-deposition process to form a uniform and fine coating is called alloy plating (in general, its smallest component should be greater than 1%).

Leveling capability: Flattening capacity (ie, microscopic dispersibility) refers to the ability to make the microstructure of the plating layer smoother than the surface of the substrate when the coating is formed on the metal surface. It expresses the roughness of the base metal is relatively small, the depth of the hole is less than 0.5mm, the distance between the crest and the trough is very small.

Pinhole or pitting: Hydrogen is adhered to the surface of the cathode in the form of bubbles to prevent the metal from depositing at these locations. It can only be deposited around the bubble. If the hydrogen bubbles remain on the cathode surface throughout the plating process, Of the coating will have holes or through the gap; if the hydrogen bubbles in the plating process is not strong adhesion, but intermittent alternately escape and adhesion, then these parts will form shallow or acupuncture points in the electroplating industry in the usual Call it pinhole or pitting.

Bubble: After plating, when the temperature of the surrounding medium increases, the adsorption of hydrogen in the matrix metal will expand and make the coating produce small bubbles, seriously affecting the quality of the coating. This phenomenon is particularly evident when electroplating zinc, cadmium, lead and other metals.

Coverage: Coverage (or deep plating capacity) is also an important performance indicators of the bath, refers to a certain electrolysis conditions in the deposition of metal on the surface of the metal parts of the full coverage of the ability, that is, under certain conditions in the groove or deep The ability of the metal to deposit a metal coating in the hole is the degree to which the coating is distributed over the part.

Hydrogen embrittlement: Hydrogen ions in the cathode after the reduction, the formation of a part of the electroplating of the formation of hydrogen hydrogen escape, part of the state of hydrogen into the matrix metal (especially high-strength metal materials) and coating, so that the base metal and coating toughness decreased Crisp, this phenomenon is called "hydrogen embrittlement".